Inside Dia 123mm Stainless Steel Targets High Density

Place of Origin Baoji, Shaanxi, China
Brand Name Feiteng
Certification GB/T19001-2016 idt ISO9001:2015 GJB9001C-2017
Model Number Stainless Steel Tube Target
Minimum Order Quantity To be negotiated
Price To be negotiated
Packaging Details Vaccum package in wooden case
Delivery Time To be negotiated
Payment Terms T/T
Supply Ability To be negotiated
Product Details
Brand Name Feiteng Model Number Stainless Steel Tube Target
Size φ150*φ123*1091mm Certification GB/T19001-2016 Idt ISO9001:2015 MANAGEMENT SYSTEM CNAS C034-M
Place Of Origin Baoji, Shaanxi, China Steel Grade 304
Welding Line Type Seamless Packaging Vaccum Package
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123mm Stainless Steel Targets


High Density Stainless Steel Targets


OD150 Stainless Steel Targets

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Product Description

OD150*ID123*1091 Stainless Steel 304 Stainless Steel Tube Target 

Product Stainless Steel Tube Target
Size φ150*φ123*1091
Grade Titanium Gr5
Packaging Wooden case
Port of delivery Xi'an port, Beijing port, Shanghai port, Guangzhou port, Shenzhen port


Target materials in the semiconductor industry. Semiconductor materials can be divided into wafer materials and packaging materials. Packaging materials have lower technical barriers compared with wafer manufacturing materials. There are seven types of semiconductor materials and chemicals involved in wafer production, one of which is sputtering target materials. The target material is one that is bombarded by high-speed charged particles. By changing different target materials (such as aluminum, copper, stainless steel, titanium, nickel targets, etc.), different film systems (such as superhard, wear-resistant, corrosion-resistant alloy films, etc.) can be obtained.


Purity is one of the main performance indexes of the target material, because the purity of the target material has a great influence on the performance of the film. But in practice, the purity requirements of target materials are also different. Impurities in solid materials and oxygen and water vapor in pores are the main sources of film deposition. In order to reduce the porosity of solid target material and improve the performance of sputtering film, the target material is usually required to have a high density. Density is also one of the key performance indexes of target materials. The density of the target material affects not only the sputtering rate but also the electrical and optical properties of the thin films. The higher the target density, the better the film forming performance. In addition, the density and strength of the target material can be improved by making the target material withstand thermal stress better during sputtering.