ODM Stainless Steel Tube Target OD150*ID123*1091mm

Place of Origin Baoji, Shaanxi, China
Brand Name Feiteng
Certification GB/T19001-2016 idt ISO9001:2015 GJB9001C-2017
Model Number Stainless Steel Tube Target
Minimum Order Quantity To be negotiated
Price To be negotiated
Packaging Details Vaccum package in wooden case
Delivery Time To be negotiated
Payment Terms T/T
Supply Ability To be negotiated
Product Details
Brand Name Feiteng Model Number Stainless Steel Tube Target
Size φ150*φ123*1091mm Certification GB/T19001-2016 Idt ISO9001:2015 MANAGEMENT SYSTEM CNAS C034-M
Place Of Origin Baoji, Shaanxi, China Packaging Vaccum Package
Steel Grade 304 Welding Line Type Seamless
High Light

ODM Stainless Steel Tube Target


Stainless Steel Tube Target OD150


ID123 Seamless Tube Targets

Leave a Message
Product Description

Stainless Steel Tube Target OD150*ID123*1091mm Stainless Steel 304

Product Stainless Steel Tube Target
Size φ150*φ123*1091mm
Grade Titanium Gr5
Packaging Wooden case
Port of delivery Xi'an port, Beijing port, Shanghai port, Guangzhou port, Shenzhen port


The semiconductor industry have a word, target material, semiconductor material can be divided into wafer material and packaging material, packaging material has a relatively low technical barrier compared to wafer manufacturing materials.There are seven kinds of semiconductor materials and chemicals involved in the production of wafers, one of which is the sputtering target material. The target material is the target material bombarded by high speed charged particles. By changing different target materials (such as aluminum, copper, stainless steel, titanium, nickel target, etc.), different film systems (such as superhard, wear-resistant, anti-corrosion alloy film, etc.) can be obtained.


Purity is one of the main performance indexes of the target material, because the purity of the target material has a great influence on the properties of the film.However, in practical application, the purity requirements of the target material are also different.The impurities in the solid material and the oxygen and water vapor in the pores are the main sources of film deposition.In order to reduce the porosity in the solid of the target material and improve the properties of the sputtered film, the target material is usually required to have a higher density.The density of the target material affects not only the sputtering rate but also the electrical and optical properties of the films.The higher the density of the target material, the better the film performance.In addition, the density and strength of the target material can be improved so that the target material can better bear the thermal stress in the sputtering process.Density is also one of the key performance indexes of the target material.