ODM Stainless Steel Tube Target OD150*ID123*1091mm

Stainless Steel Tube Target OD150*ID123*1091mm Stainless Steel 304

The semiconductor industry have a word, target material, semiconductor material can be divided into wafer material and packaging material, packaging material has a relatively low technical barrier compared to wafer manufacturing materials.There are seven kinds of semiconductor materials and chemicals involved in the production of wafers, one of which is the sputtering target material. The target material is the target material bombarded by high speed charged particles. By changing different target materials (such as aluminum, copper, stainless steel, titanium, nickel target, etc.), different film systems (such as superhard, wear-resistant, anti-corrosion alloy film, etc.) can be obtained.

Purity is one of the main performance indexes of the target material, because the purity of the target material has a great influence on the properties of the film.However, in practical application, the purity requirements of the target material are also different.The impurities in the solid material and the oxygen and water vapor in the pores are the main sources of film deposition.In order to reduce the porosity in the solid of the target material and improve the properties of the sputtered film, the target material is usually required to have a higher density.The density of the target material affects not only the sputtering rate but also the electrical and optical properties of the films.The higher the density of the target material, the better the film performance.In addition, the density and strength of the target material can be improved so that the target material can better bear the thermal stress in the sputtering process.Density is also one of the key performance indexes of the target material.