133OD*125ID*2940L Vacuum Coating Tube Targets OEM ODM

Place of Origin Baoji, Shaanxi, China
Brand Name Feiteng
Certification GB/T19001-2016 idt ISO9001:2015 GJB9001C-2017
Model Number Titanium tube target
Minimum Order Quantity To be negotiated
Price To be negotiated
Packaging Details Vacuum package in wooden case
Delivery Time To be negotiated
Payment Terms T/T
Supply Ability To be negotiated
Product Details
Shape Tube Grade Gr2
Certification GB/T19001-2016 Idt ISO9001:2015 GJB9001C-2017 Packaging Vacuum Package In Wooden Case
Color Shine With Grey Or Dark Grey Metallic Luster Standard ASTM B861-06 A
Place Of Origin Baoji, Shaanxi, China Application Semiconductor,electronic,displayer,etc
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2940L Tube Targets ODM


125ID Tube Targets OEM


133OD Vacuum Coating tube target

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Product Description

133OD*125ID*2940L Include Flange Titanium Tube Target Titanium Gr2 ASTM B861-06 a The Target Material Vacuum Coating

Name Titanium tube target

ASTM B861-06 a

Transport Package

Vacuum package in wooden case


Baoji, Shaanxi, China

Port of deliver

Xi'an port, Beijing port, Shanghai port, Guangzhou port, Shenzhen port

Size φ133*φ125*2940(include flange)


The development trend of tube target technology is closely related to the development trend of thin film technology in downstream industries. Vacuum coating technology is generally divided into two categories: physical vapor deposition (PVD) technology and chemical vapor deposition (CVD) technology.
Physical vapor deposition technology refers to the use of a variety of physical methods under vacuum conditions, the plating materials vaporized into atoms, molecules or separated into ions, directly deposited on the surface of the matrix method. The preparation of hard reactive films is mostly made by physical vapor deposition method. It uses some physical processes, such as thermal evaporation of substances or sputtering of atoms on the surface of substances when bombarded by ions, to realize the controllable transfer process of atoms from the source material to the film. Physical vapor deposition technology has the advantages of good film/base bonding force, uniform and compact film, controllable film thickness, wide target materials, wide sputtering range, thick film can be deposited, stable alloy film can be prepared and good repeatability. At the same time, the physical vapor deposition technology can be used as the final processing technology for HSS and cemented carbide thin-film tools because the processing temperature can be controlled below 500℃. Because the cutting performance of cutting tools can be greatly improved by using physical vapor deposition process, while developing high performance and high reliability equipment, its application field is expanded, especially in high speed steel, hard alloy and ceramic tools for more in-depth research.
Chemical vapor deposition technology is the elemental gas containing a membrane element or compound supply base, with the aid of the gas phase or substrate on the surface of a chemical reaction, on the matrix method of making metal or compound film, mainly including atmospheric pressure chemical vapor deposition, low pressure chemical vapor deposition and has both features of CVD and PVD plasma chemical vapor deposition, etc.




Main advantages
Low density high specification strength
Custom request customization
Excellent corrosion resistance
Good heat resistance
Excellent low temperature performance
Good thermal properties
Low elastic modulus